By leveraging the silicon photonic carrier dispersion effect and optimizing the energy and dose conditions of ion implantation, a low-loss, high-efficiency PN junction has been achieved. Additionally, through system-level optoelectronic co-design, the junction capacitance, series resistance, and inductance of the modulator are comprehensively designed. This allows the traveling-wave electrode of the modulator to simultaneously achieve impedance matching and velocity matching. The combination of the high-efficiency, low-loss PN junction design and the optimized traveling-wave electrode design ultimately enables higher bandwidth while maintaining the modulator length. Thanks to these advantages, the modulator can achieve high-speed signal transmission at low voltage swings and is highly compatible, capable of matching most drivers.

Based on silicon-on-insulator (SOI) technology compatible with CMOS processes, monolithic integration of Frequency-Modulated Continuous Wave (FMCW) modulators, large-scale Optical Phased Arrays (OPAs), and coherent balanced receivers has been achieved. This enables the emission and coherent detection of directional signals, and instantaneously measures five dimensions: three-dimensional vectors, velocity, and acceleration, providing an ultimate solution for autonomous driving. - Solid-state design: The all-solid-state design significantly enhances reliability. - Integrated transmitter and receiver: The compact structure with integrated transmitter and receiver greatly reduces packaging complexity. - Coherent detection: This method effectively immunizes the system against ambient light noise interference. - Support for hybrid integration: The design supports co-packaging of hybrid-integrated lasers and custom ASICs.

Based on LCOS (Liquid Crystal on Silicon) technology, the projection chip meets the automotive-grade requirements for AR-HUD products, offering high resolutions of 2K to 4K and a large field of view (FOV) of 12°×4°. It also features low product dimensions and cost。